eMMC | Chipsmall

eMMCResults: 37

Manifakti

SANDISK

SAMSUNG

結果剩餘: 37

Produi	庫存	Pri Inite
KLMEG8UCTA-B041 SAMSUNG eMMC 5.1 256 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production	14292 (disponib)	1+98.00000 10+73.50000 30+63.70000 更多的價格
KLMBG4GESD-B04P SAMSUNG eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production	4836 (disponib)	查詢
KLM8G1GETF-B041 SAMSUNG eMMC 5.1 8 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production	44740 (disponib)	1+59.07200 10+44.30400 30+38.39680 更多的價格
KLM8G1GESD-B04Q SAMSUNG eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production	1 (disponib)	查詢
KLMCG2KCTA-B041 SAMSUNG eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production	4027 (disponib)	查詢
KLMAG2GEUF-B04Q SAMSUNG eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production	5684 (disponib)	1+7.66320 10+6.89688 30+5.36424 更多的價格
KLMDG8JEUD-B04Q SAMSUNG eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C Mass production	5709 (disponib)	1+27.19200 10+20.39400 30+17.67480 更多的價格
KLMBG4GESD-B03P SAMSUNG eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production	21846 (disponib)	1+39.70000 10+29.77500 30+25.80500 更多的價格
KLMAG2GESD-B04Q SAMSUNG eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production	3815 (disponib)	查詢
KLMCG4JEUD-B04P SAMSUNG eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C Mass production	4924 (disponib)	查詢