eMMC | Chipsmall

eMMCResults: 37

Manifakti

SANDISK

SAMSUNG

結果剩餘: 38

Produi	庫存	Pri Inite
KLMBG2JETD-B041 SAMSUNG eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production	8960 (disponib)	1+15.39120 10+13.85208 30+10.77384 更多的價格
KLMAG2GESD-B03P SAMSUNG eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production	3477 (disponib)	查詢
KLM8G1GESD-B03Q SAMSUNG eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production	14400 (disponib)	1+10.68480 10+9.61632 30+7.47936 更多的價格
KLM8G1GEUF-B04P SAMSUNG eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production	2000 (disponib)	1+7.52760 10+6.77484 30+5.26932 更多的價格
KLM8G1GESD-B04P SAMSUNG eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production	3336 (disponib)	查詢
KLMBG4GEUF-B04Q SAMSUNG eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production	5086 (disponib)	1+15.94000 10+14.34600 30+11.15800 更多的價格
KLMBG4GESD-B04Q SAMSUNG eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production	4729 (disponib)	查詢
KLMCG4JETD-B041 SAMSUNG eMMC 5.1 64 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production	22900 (disponib)	1+20.90900 10+15.68175 30+13.59085 更多的價格
KLMDG4UCTA-B041 SAMSUNG eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production	5545 (disponib)	查詢
KLMBG4GESD-B03Q SAMSUNG eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production	5485 (disponib)	查詢